Xbox Series X / S
Nintendo Switch
PlayStation 5
PlayStation 4
On the Go
Other
Original chips improve the performance of computer
Selected original chips, strict inspection process, 8-layer PCB board, stable performance.
Aluminum alloy vest for effective heat dissipation
Aluminum alloy vest, strong heat dissipation effect, low working temperature, more stable operation
Gold-plated craft gold finger
Gold plating process, stronger conductivity and corrosion resistance
| Features | |
|---|---|
| Lead plating | Gold |
| Cooling type | Heatsink |
| Memory voltage | 1.35 V |
| Memory channels | Single-channel |
| CAS latency | 16 |
| ECC | No |
| Memory form factor | 288-pin DIMM |
| Component for | PC |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Buffered memory type | Unregistered (unbuffered) |
| Operational conditions | |
|---|---|
| Storage temperature (T-T) | -55 - 100 °C |
| Operating temperature (T-T) | 0 - 85 °C |
| Sustainability | |
|---|---|
| Doesn't contain | Halogen |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Weight & dimensions | |
|---|---|
| Height | 37.5 mm |
| Depth | 6.1 mm |
| Width | 137.5 mm |
